MICL Technial Conference 2020

STAY AHEAD OF THE INDUSTRY

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יקבי בינימינה Feb 26th, 8:00

Agenda

Feb 26

8:00

Meet & Greet Breakfast

9:00

HiSol- Latest technology for IC package decapsulation

9:50

ThetaMetrisis non destructive solutions- Thickness measurement of coatings in the A-nm-μm-mm range

14:00

Networking

16:00

Q & A Session

 

Agenda

Feb 26

8:00

Meet & Greet Breakfast

9:00

HiSol- Latest technology for IC package decapsulation

9:50

ThetaMetrisis non destructive solutions- Thickness measurement of coatings in the A-nm-μm-mm range

14:00

Networking

16:00

Q & A Session

Agenda

Feb 26

8:00

Meet & Greet Breakfast

9:00

HiSol- Latest technology for IC package decapsulation

9:50

ThetaMetrisis non destructive solutions- Thickness measurement of coatings in the A-nm-μm-mm range

14:00

Networking

16:00

Q & A Session

Presentations

NovaCentrix- NovaCentrix Company Introduction and Innovations in Photonic Curing- Presented by Alex Rose

ThetaMetrisis non destructive solutions- Thickness measurement of coatings in the A-nm-μm-mm range- Presented by Dr. Ioannis Rapitis

Izak (Kapi) Kapilevich, Application Specialist-

Die/wafer level electrical failure analysis utilizing photo emission microscopy, dynamic laser stimulation, laser voltage imaging and laser voltage probing. Application, use case and future challenges

Gel-Pak- Proven carrier solutions protecting critical devices

Allied High Tech Products- Gary Liechty, Manager International Sales

Izak (Kapi) Kapilevich, Application Specialist-Die Level/Wafer Level EFA Utilizing PEM, DLS, LVI, LVP and CL
SEM
Application, Use Cases and Future Challenges.

The Event

Pictures

 
 

Than

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