MICL Technical Conference 2020
Stay Ahead of the Industry
יקבי ×‘×™× ×™×ž×™× ×” Feb 26th, 8:00
Agenda
Feb 26
8:00
Meet & Greet Breakfast
9:00
HiSol- Latest technology for IC package decapsulation
9:50
ThetaMetrisis non destructive solutions- Thickness measurement of coatings in the A-nm-μm-mm range
14:00
Networking
16:00
Q & A Session
Agenda
Feb 26
8:00
Meet & Greet Breakfast
9:00
HiSol- Latest technology for IC package decapsulation
9:50
ThetaMetrisis non destructive solutions- Thickness measurement of coatings in the A-nm-μm-mm range
14:00
Networking
16:00
Q & A Session
Agenda
Feb 26
8:00
Meet & Greet Breakfast
9:00
HiSol- Latest technology for IC package decapsulation
9:50
ThetaMetrisis non destructive solutions- Thickness measurement of coatings in the A-nm-μm-mm range
14:00
Networking
16:00
Q & A Session
Presentations
NovaCentrix- NovaCentrix Company Introduction and Innovations in Photonic Curing- Presented by Alex Rose
ThetaMetrisis non destructive solutions- Thickness measurement of coatings in the A-nm-μm-mm range- Presented by Dr. Ioannis Rapitis
Izak (Kapi) Kapilevich, Application Specialist-
Die/wafer level electrical failure analysis utilizing photo emission microscopy, dynamic laser stimulation, laser voltage imaging and laser voltage probing. Application, use case and future challenges
Gel-Pak- Proven carrier solutions protecting critical devices
Allied High Tech Products- Gary Liechty, Manager International Sales
Izak (Kapi) Kapilevich, Application Specialist-Die Level/Wafer Level EFA Utilizing PEM, DLS, LVI, LVP and CL
SEM
Application, Use Cases and Future Challenges.
The Event
Pictures
